Aloman Co., Ltd. for urgent procurement of
ICs and electronic components

TEL.+81-44-934-0034

Business hours : 9:00 AM to 5:30 PM
(excluding Saturdays, Sundays, and holidays)

●Processing services

At Aloman, we provide services such as embossed taping and writing starting from small quantities at the
well-equipped facilities of our group company (Takumi Shoji's distribution center).


Tokorozawa Center

Isehara Center

Writing/stamping services(Processed 5 million in 2020)

Products handled

●Flash microcomputers ●Flash memory ●EEPROM ●PLD ●Programmable crystal


Major manufacturers handled (ACTEL/SEIKO EPSON (SG8000 series) are write-certified)

●Renesas ●Toshiba ●Fujitsu ●TI ●NXP ●Lattice ●Microchip ●Atmel ●Cypress ●Altera

●Micronix ●ACTEL ●SEIKO EPSON ●Micron ●Analog Devices and more

●Renesas ●Toshiba ●Fujitsu ●TI ●NXP ●Lattice ●Microchip ●Atmel ●Cypress ●Altera ●Micronix ●ACTEL ●SEIKO EPSON ●Micron ●Analog Devices and more


Main equipment (example)


For crystal oscillators

For microcomputers

Laser stamping machine


Features

●Everything is handled by our own equipment.

●We also handle blank checks.

●We also handle special stamps (lasers).

Taping processing services(Handled 8 million in 2020)

We can subdivide the minimum shipping unit (2K pieces, 3K pieces, etc.)
for manufacturer taping products in the desired quantity.

Products handled

Major manufacturers handled (ACTEL/SEIKO EPSON (SG8000 series) are write-certified)

Tape width of 8 mm to 56 mm supported


MOQ reel → Subdivision reel


Main equipment


Automatic machines (5 units)

Manual machines (4 units)

Peeling strength inspection machine


Features

●Everything is handled by our own equipment.

●We support a wide variety of products in small quantities. (There are no quantity restrictions. We will wind the

required number)

●Abundant inventory. (We have inventory from over 100 manufacturers and tens of thousands of varieties,

mainly general-purpose products)

●Joint taping processing is provided.


Baking services

Semiconductors that have absorbed moisture from mold resin must be dehumidified (baked) before mounting.

Baking conditions: Carried out at 125℃ for 24 hours.


Incubators (heat treatment devices)